Product Name

Inline BSG Removal Equipment

Model

KSBSG

Route Application

TOPCON、XBC

Function

Removing Boron Silicate Glass (BSG) from Photovoltaic Solar Cells

Process Flow

Water Film→HF→Water Film→HF→Rinse→Drying

Compatible Wafer

12 lanes for 182mm wafer; 10 lanes for 210/230mm wafer, compatible with various sizes wafers

Lane Number

182mmx182mm: 12 lanes (6+6 configuration); 210-230mm: 10 lanes (5+5 configuration)

Operation Speed

2-5m/min Adjustable

Capacity

182mm: ≥16000 pcs/hour; 210mm: ≥12500 pcs/hour

Breakage Rate

Breakage Rate <0.01% (Silicon wafer thickness ≥130um)

Power Consumption/ Voltage

~33KW/380V

Features

High-speed precision liquid-carrying etching roller to avoid under-etching or over-etching at the edges; precise water film control to ensure complete coverage without dripping; real-time monitoring of solution conductivity to ensure etching process stability; stable production at 4.5m/min, less friction, longer consumable life.